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    Solder Paste
    SOLDER PASTE
    Tin Lead Solder paste
    PRODUCT SELECTION
    DETAILED INTRODUCTION
    PRODUCT LIST

    Features and Benefits

    ·  Good fluidity, excellent solderability can be attained at small pattern of 0.3mm pitch bonding pad.

    ·  Stable printability with little change in viscosity when printing continuously.

    ·  Long Stencil Life - 12 Hours with continuous and consistently  printing.

    ·  Remain in the same size, shape and position  without slumping after several hours of printing.

    ·  Good solderbility, adequate wettability is shown on various parts.

    ·  Adapted to soldering equipments with different grades;  Soldering without nitrogen is available; The soderability is still good in a comparatively wide reflow temperature range, both RSS and RTS temperature setting method are available.


    Applications

    PCB assembly, including smartphone, Tablet PC, motherboards,  consumer electronics, web server, Auto electrical system, and equipments of medical, military or aerospace etc.

    PRODUCT LIST
    Alloy
    Size
    Features&Application
    63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type3(45~25),Type4(38~20) CSP Excellent wetting properties, Heat resistance
    63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type3(45~25),Type4(38~20) Tiny pitch for home appliances, vehicle etc.
    63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type3(45~25),Type4(38~20) /
    63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type3(45~25);Type4(38~20) Used in semiconductor packaging
    63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type3(45~25);Type4(38~20) Highly active product
    63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type2.5(25~63);Type3(45~25);Type4(38~20) Low yellow residue,Fit for white board like LED
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