In the 1970s, with the rise of surface mount technology (SMT), solder paste emerged. At the time, the related industry in my country was still in its infancy. European, American, and Japanese solder paste brands capitalized on this momentum and dominated the solder paste application market. It wasn't until the turn of the century and around the turn of the millennium that China gradually developed its own solder paste brands. Today, the domestic solder paste industry has been developing for many years, and the products are gradually maturing.
Domestic solder paste, represented by the Zhongshi brand, has accumulated technology over the years. Zhongshi can provide customers with various alloy solder pastes, including lead-free solder paste, tin-lead solder paste, halogen-free solder paste and other solder paste products that can be canned or syringe packaged.
The high reliability, low void rate and good solder creep performance of Zhongshi solder paste in actual applications have been fully recognized by customers.
In order to meet customers' continuous innovation needs, "minimizing the void rate and improving product reliability" has become the goal that Zhongshi solder paste product research and development continues to pursue.
At the end of 2022, Zhongshi successfully developed a new, ultra-low voiding solder paste: ZSRX01-RMB2. Recently, this solder paste performed exceptionally well in semiconductor packaging samples from a renowned automotive company, achieving a voiding rate of less than 1%, comparable to international brands and marking another breakthrough for a Chinese brand in this field.
The above is part of the experimental data of ZSRX01-RMB2
ZSRX01-RMB2 Product Features:
Extremely low void ratio, meeting the welding requirements of semiconductor and other precision components;
High reliability;
Excellent printability and printing life;
The influence of void ratio on welding quality
One of the criteria for inspecting welding quality is the void ratio of the weld. When the "void" size is large or its local density is too high, it will affect the mechanical properties of the weld layer and reduce the connection strength; it will also reduce the thermal conductivity of the weld layer, causing local overheating of the device and causing failure.
Therefore, the void ratio has an extremely important impact on the reliability of key electronic components.
