Mini-LED refers to LED chips with a size of 100μm, which is between small-pitch LED and Micro LED. It is the result of further refinement of small-pitch LED. Small-pitch LED refers to LED backlight or display products with a spacing of less than 2.5mm between adjacent LED dots.
Mini-LED uses LED chips with a size of micron level. Each Mini-LED circuit board usually has thousands of chips and tens of thousands of solder joints to connect the RGB three-color chips.
Therefore, compared to traditional reflow soldering processes, Mini-LEDs place extremely high demands on process quality. According to statistics, over 40% of soldering defects are caused by the printing process, and 40% by soldering. The remaining 20% is largely related to solder paste and substrate materials. Reliable Mini-LED soldering places higher demands on reflow equipment, soldering processes, and materials (solder paste); all three are essential.
In such a precise and delicate soldering process, solder paste plays a vital role as the main bonding material.
Guangdong Zhongshi Metal Co., Ltd. has developed a Mini-LED-specific solid-crystal solder paste for the Mini-LED printing process. It has stable physical properties and anti-oxidation performance, good printability and demolding properties, uniform tin deposition, and ultra-fine solder powder, which makes the amount of tin deposition more stable during demolding. It also has excellent welding reliability, ultra-low void rate, little post-soldering residue, and no chip tilting or offset.
Currently, 5-8# powder can be configured according to customer needs, and can be packaged in syringes or cans.
Free samples and orders, please contact us!
Contact number: 0769-85231818 / 400-853-0080
