QFN, quad flat no-lead package, is one of the surface mount packages.
According to the IPC-A-610 standard QFN side pad creep tin requirements, it is divided into three levels:
Level 1: The wetting of the bottom filling tin of the QFN pad is obvious;
Level 2 is 25% of the side pad height;
Level 3 standard is 50% of the side pad height;
Nowadays, the development of electronic components is changing with each passing day. The 50% solder creepage standard or even 60%-70% solder creepage is far from meeting the needs of some customers.
Adhering to the core value of "focusing on customer needs, providing competitive products, and making customers more outstanding", Zhongshi Company actively carries out research and development, and works side by side with customers to overcome technical difficulties.
Recently, Zhongshi Company independently developed a new solder paste, model: ZSRX01-RMB3. After multiple rounds of internal testing and external samples, the QFN solder creep rate easily reached 85%-90%.
The following is some sample data:
Zhongshi RMB3 solder paste QFN solder creep rate 85%-90%
Compared with a certain manufacturer's solder paste QFN solder creep 60%-70%
Zhongshi RMB3 solder paste has little residue after soldering and a transparent appearance
The void rate of Zhongshi RMB3 solder paste after soldering is 7.724%
ZSRX01-RMB3 product features:
Halogen-free;
High reliability;
Ultra-low void ratio;
Little residue after welding and transparent appearance;
QFN soldering is good.
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Free samples and orders, please contact us!
Tel: 0769-82885678
