From March 20th to 22nd, 2024, the three-day 2024 Munich Shanghai Electronic Production Equipment Exhibition came to a successful conclusion. In this exhibition, we will use advanced packaging materials used in new energy vehicles, semiconductors, consumer electronics, automotive electronics, power electronics, communication equipment and other fields to appear at the exhibitionIt has attracted the attention of many domestic and foreign customers, and there is an endless stream of customers who come to consult and cooperate.
As a leading material manufacturing expert and supplier in the industry, CIIC Metal has long served the global electronics, semiconductor, precision welding and high-precision copper profile application markets. With industry-leading R&D technology and customized solutions, the company continues to meet the needs of customers in product application and innovation. The advanced packaging materials exhibited this time are the crystallization of CIIC Metal's continuous innovation and breakthroughs in the field of materials science, demonstrating its strong strength in promoting the development of the industry.
During the exhibition, CIIC Metal's professional team had in-depth exchanges with customers and shared insights on the technical characteristics, application scenarios, and future development trends of advanced packaging materials. Customers showed strong interest in CIIC Metal's products and expressed their desire to further understand the possibility of cooperation.
Exhibition site
The successful holding of this exhibition not only enhanced the popularity and influence of CIIC Metal in the industry, but also laid a solid foundation for the company to further expand domestic and foreign markets. CIIC Metal will continue to uphold the core values of innovation, quality and service, provide better products and services to global customers, and jointly promote the prosperity and development of the electronic production equipment industry.
In the future, CIIC Metal will continue to deepen the field of materials science, increase investment in R&D, and continue to launch more innovative and competitive products to contribute more to the development of the global electronics industry. At the same time, the company will also strengthen cooperation and exchanges with domestic and foreign customers, jointly explore more cooperation opportunities, and achieve mutual benefit and win-win results.
