IGBT is a composite fully controlled voltage-driven power semiconductor device consisting of a BJT bipolar transistor and an insulated gate field effect transistor MOS.
IGBT has low driving power and low saturation voltage drop. It is the core component of energy conversion and transmission, commonly known as the "CPU" of power electronic devices. It is widely used in rail transportation, smart grid, aerospace, electric vehicles and new energy equipment.
The application of IGBT modules determines that they must not only have extremely high reliability but also have a long service life.
IGBTs generate significant power losses during current switching, making heat dissipation a key factor affecting their reliability. The chip and substrate solder joints are the primary heat transfer channels for IGBTs, and the quality of these joints impacts the reliability and lifespan of the IGBT.
Research has shown that when voids appear in the solder layer, the chip junction temperature increases, and the chip junction temperature is almost directly proportional to the void rate in the solder layer. This affects the thermal cycle, causing localized overheating and shortening the module's lifespan. For every 10°C increase in device operating temperature, the failure rate roughly doubles.
Therefore, for IBGT packaging, the most important thing is to reduce the void rate of the solder layer.
Zhongshi develops IGBT preforms
Domestic first
> IGBT octal alloy solder piece
Features:
-Meet the high reliability and ultra-long life requirements of new energy vehicles
-Longer product life cycle
> IGBT reinforced contour solder tabs
Features:
- High strength
- Uniform stress distribution
- Uniform welding layer and controllable welding height
- Low void rate
Void rate comparison
Experimental data
The following is comparative experimental data, from which we can see that Zhongshi IGBT preforms effectively reduce the solder void rate and provide better product stability.
At present, Zhongshi IGBT preforms have been stably supplied to major semiconductor companies, new energy vehicle companies, etc.
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