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Solder Preforms
Solder Preforms
Indium-based Solder Preforms

Indium has good ductility and malleability, with a melting point of only 157 ℃. It can form a series of low melting eutectic solder materials with elements such as Sn, Pb, Ag, etc.

Product Selection
Detailed Introduction
Product List

Features & Benefits

·  Low melting point

·  Low vapour pressure

·  Favorable ductility and malleability

·  Good thermal fatigue properties

·  Repeatable welding and reflow soldering at low temperature is available.

·  Nice resistance in drop tests 

·  Superior thermal conductivity


Product Application

Indium has a high thermal conductivity (86W / mK at 85°C). Therefore, it is widely used in thermal management, and the heat generated by electronic components can be effectively eliminated through it.

 

·  Vacuum electronic devices packaging

·  Glass packaging

·  Ceramic packaging

·  Low-temperature superconductive device packaging

Product List
Model
Solid Lin
℃
Liquidus
℃
Eutectic Alloy
℃
Density
g/cm3
Resistivity
µΩ.m
Thermal Conductivity
W/m.K
Thermal Expansion Coefficient
10-6/℃
Tensile Strength
Mpa
In51Bi32.5Sn16.5 / / 60 7.88 0.522 / 22 33.44
In66.3Bi33.7 / / 73 7.99 / / / /
Bi50Pb28Sn22 / / 100 / / / / /
In52Sn48 120 122 / 7.3 0.147 120 20 12
Sn50In50 118 125 / 7.3 0.147 118 20 11.86
In80Pb15Ag5 149 154 / 7.85 / 149 / /
In97Ag3 / / 143 7.38 0.075 / 22 5.5
In100 / / 157 7.31 0.072 / 29 1.88
In60Pb40 174 185 / 8.52 0.246 174 27 28.61
Sn77.2In20Ag2.8 175 187 / 7.25 0.176 175 28 46.88
In50Pb50 184 210 / 8.86 0.287 184 27 32.2
Pb60In40 197 231 / 9.3 0.331 197 26 34.48