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Tin Lead Solder Paste-ZSPM01

High reliability, low voidage; Strong weldability: It can meet the difficult needs of some important lead-free devices, such as CSP, QFN, etc.

Product Characteristics

ZSRH01-N can completely solve the problem of oxidizing part electrodes placed for a long time, solder pads with poor condition of tinspray plates, Ni materials that are difficult to weld, QFN/Au plating modules with tin climbing problems, etc.

 

Specification

METAL COMPOSITIONPARTICLEFLUX CONTENT

SAC305

SAC105

SAC0307

Type3（25～45um）11.5±0.5%
Type4（20～38um）11.7±0.5%
Type5（15～32um）11.8±0.5%

 

Product Characteristics

ITEM

CHARACTERISTIC VALUE

TEST METHOD

Halide Content（％）0.20±0.05JIS Z 3197-8.1.4.2.1
Copper Plate corrosionUnoccurredJIS Z 3284-4
Aqueous Impedance（Ω･cm）＞1×104JIS Z 3197-8.1.1

Insulation Impedance

（Ω）  

40℃/90%RH＞1×1011JIS Z 3284-3
85℃/85%RH＞1×108
Migration TestNo migrationJIS Z 3284-14
Diffusivity（％）＞ 75JIS Z 3197-8.3.1.1
Viscosity（Pa･s）180±30JIS Z 3284-6
Tin ShotLv.1～3JIS Z 3284-11
PrintabilityM3JIS Z 3284-5
Printing Collapse0.3mm belowJIS Z 3284-7
Heating Collapse0.3mm belowJIS Z 3284-8

 

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Tin Lead Solder Paste ZSPM01
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