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Solder Preforms
Solder Preforms
Lead-free Solder Preforms

At present, there are dozens of lead-free solder materials, and the alloy materials used are also diverse, including binary, ternary, and multicomponent alloy compositions.


But in general, most of them are composed mainly of tin Sn, with appropriate addition of metal elements such as silver Ag, zinc Zn, copper Cu, antimony Sb, bismuth Bi, indium In, etc., and mainly improve the alloy properties through solder alloying to obtain ideal mechanical, electrical, and thermal properties.


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Product features and advantages

·  Good Mechanical Properties

·  Superior electrical conductivity

·  High thermal conductivity

 


Typical Products

Sn-Ag-Cu Preforms

Sn-Ag-Cu (SAC) is the most common alloy in soldering electronics. Such as those alloys whose melting point is around 217℃, like SAC105(Sn98.5Ag1Cu0.5), SAC305 (Sn96.5Ag3Cu0.5)、SAC387(Sn95.5Ag3.8Cu0.7) and SAC405(Sn95.5Ag4Cu0.5) are usually used in reflow, wave and manual soldering. 

 

Among above, SAC305 are more wildly used. Compared with Sn63Pb37, it has better performance on stiffness, tensile strength, yield strength, shear strength, impact strength and creep strength;  compared with Sn-Cu/Sn-Ag preforms, it’s wetting properties are better.

Product List
Model
Solid Lin
Liquidus
Eutectic Alloy
Density
g/cm3
Resistivity
µΩ.m
Thermal Conductivity
W/m.K
Thermal Expansion Coefficient
10-6/℃
Tensile Strength
Mpa
Bi58Sn42 / / 138 8.56 0.383 / 15 55.16
Bi57Sn42Ag1 138 140 / 8.57 / 138 / /
Sn98.5Ag1.0Cu0.5 217 227 / 7.32 0.133 217 / 40
SAC305(Sn96.5Ag3.0Cu0.5) 217 218 / 7.37 0.132 217 21 50
Sn95.5Ag3.8Cu0.7 217 220 / 7.4 0.132 217 22 48
SAC405(Sn95.5Ag4.0Cu0.5) 217 220 / 7.4 0.132 217 / 51.5
Sn96Ag3.5Cu0.5 217 218 / / / 217 / /
Sn96.5Ag3.5 / 221 / 7.37 0.108 / 30 39
Sn95Ag5 221 240 / 7.4 0.137 221 23 55.2
Sn95.5Ag3.9Cu0.6 217 220 / / / 217 / /
Sn99Ag0.3Cu0.7 217 227 / / / 217 / /
Sn95Sb5 235 240 / 7.25 0.145 235 31 40.7