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Solder Paste
Solder Paste
Fine Solder Powder
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Detailed Introduction
Product List

Features and Benefits

·  Applied to 0.3mm picth bonding pad.

·  Type 5 solder powder (10～25 µm) can be used for 0402 components soldering.

·  Excellent printability.

·  Good heat-resistance and wetting properties.


Applications

Smartphone, Smartwatch.

Product List
Model
Alloy
Size
Features&Application
ZSRG01 Sn-3Ag-0.5Cu Sn-1Ag-0.5Cu Sn-0.3Ag-0.8Cu Type5（15~25um）/Type6（5~15um） /
ZSPG01 63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag Type5（15~25um）/Type6（5~15um） /