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Solder Preforms
Solder Preforms
Gold-based Solder Preforms
Reinforced Solder Preforms
Silver-based Solder Preforms
Indium-based Solder Preforms
Lead-free Solder Preforms
Tin-lead Solder Preforms
Flux-Coated Preforms
Gold-based Solder Preforms
Gold-based Solder Preforms
On the premise of strictly controlling dimensional tolerances and ensuring consistency in solder volume, the thinnest thickness is 0.01mm and the minimum processing size is 0.02 * 0.02mm
Product Selection
Detailed Introduction
Product List
Features & Benefits
· Excellent corrosion resistance
· Low vapour pressure
· Excellent wetting properties
· High-melting-point, and creepless
· High tensile strength
· Superior thermal and electrical conductivity
Application Industries
Military,Semiconducto,Optical Communication,Laser,Medical Equipment,Electricity.
Product List
Model |
Solid Lin ℃ |
Liquidus ℃ |
Eutectic Alloy ℃ |
Density g/cm3 |
Resistivity µΩ.m |
Thermal Conductivity W/m.K |
Thermal Expansion Coefficient 10-6/℃ |
Tensile Strength Mpa |
|---|---|---|---|---|---|---|---|---|
| Sn90Au10 | / | / | 217 | 7.78 | / | / | / | 50.2 |
| Au80Sn20 | / | / | 280 | 14.52 | 0.224 | / | 16 | 276 |
| Au75Sn25 | 278 | 332 | / | / | / | 278 | / | / |
| Au78Sn22 | 278 | 301 | / | 14.18 | / | 278 | / | / |
| Au79Sn21 | 278 | 289 | / | 14.34 | / | 278 | / | / |
| Au88Ge12 | / | / | 361 | 14.67 | 0.151 | / | 13.4 | 185 |
| Au80Cu20 | / | / | 910 | / | / | / | / | / |
| Au50Cu50 | 955 | 970 | / | / | / | 955 | / | / |
| Au100 | / | / | 1064* | 19.3 | 0.0221 | / | 14 | 138 |
