Features and Benefits
· Improve the reliability of solder joints by providing a consistent solder joint bondline
· Excellent wetting properties
· Ultra-low voiding
· High tensile strength and crushing strength
· Non-change of the outer metals’nature.
Applications
· Ultralow temperature seal or vaccum seal
· EMI & RFI shielding
· Earth Wire
· Thermal mismatch device
· Bottom assembly gasket
Model |
Solid Lin ℃ |
Liquidus ℃ |
Eutectic Alloy ℃ |
Density g/cm3 |
Resistivity µΩ.m |
Thermal Conductivity W/m.K |
Thermal Expansion Coefficient 10-6/℃ |
Tensile Strength Mpa |
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